NEX-W DI Series for White Solder
 A new generation of high-performance DI direct imaging systems for solder mask processes, designed with a high-power exposure source, combined with a high-precision imaging and positioning locator system.
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NEX DI Series for SM
NEX series is a high performance direct imaging soldermask DI product that utilizes a high power exposure light source combined with high power imaging and high precision positioning system for non-white oil soldermask inks. They provide high productivity, high precision, and high quality window/bridge/side etch solutions for the soldermask process of multilayer boards, HDI, Rigid-Flex boards, Flex boards, and IC substrates.
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