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NEX DI Series for SM

NEX series is a high performance direct imaging soldermask DI product that utilizes a high power exposure light source combined with high power imaging and high precision positioning system for non-white oil soldermask inks. They provide high productivity, high precision, and high quality window/bridge/side etch solutions for the soldermask process of multilayer boards, HDI, Rigid-Flex boards, Flex boards, and IC substrates.
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1.Product INtroduction

NEX series is a high performance direct imaging soldermask DI product that utilizes a high power exposure light source combined with high power imaging and high precision positioning system for non-white oil soldermask inks. They provide high productivity, high precision, and high quality window/bridge/side etch solutions for the soldermask process of multilayer boards, HDI, Rigid-Flex boards, Flex boards, and IC substrates.

 

2.Product Feature

Industry Leading Direct Imaging System

Based on DMD scanning lithography solution, equipped with high-performance data processing technology and CFMEE professional optics, direct exposure without the need for a negative can save costs, shorten the process and improve yields.
High-efficiency and high-power resistant UV optical system can be combined with multi-wavelength light source, which can flexibly match with various types of photographic inks while providing the highest production speed.
Special surface treatment for the exposure table, no ink staining, no indentation.


High image quality and productivity

High-resolution and high-performance optical system ensures high-quality windowing and bridging capabilities.
High-power light source and controlled wavelength ratio enhance the polymerization of the ink bottom during the exposure process, resulting in optimal side-etching.
High Depth of Field: Market-proven CFMEE professional optical design delivers excellent depth of field, enabling optimal exposure for a wide range of boards with uneven surface heights.
High productivity: Dual table mechanism optimizes the exposure process and productivity, simultaneous board loading/unloading/alignment and exposure.


Alignment Precision and Rise and Shrink Mode

Equipped with high-precision moving platform and CCD target recognition system, the alignment accuracy is as high as ±10μm.
Shrinking function: automatic shrinking, fixed shrinking, sectional shrinking, partition shrinking, intelligent shrinking and other high-level shrinking modes, and in the process of alignment of abnormal boards automatic warning or refusal of exposure, to enhance quality control and improve yield.
Exposure: According to the size of the substrate, multiple pieces can be exposed at one time, which greatly enhances the production capacity.
Alignment ability: the system automatically catches the target alignment at high speed, which can support all kinds of targets, and can also recognize the target covered by ink as well as use the fitting function for the abnormal target, which can ensure the alignment accuracy and improve the production capacity at the same time.
Product Traceability

In any specified position, the exposure generates text or two-dimensional code for board traceability.
Supports static and dynamic stamp labels, such as time, date, serial number, equipment number, up and down values and various combinations of serial numbers.


Intelligent Manufacturing

CFMEE SMDI products are equipped with hardware and software functions related to intelligent manufacturing to realize highly automated and intelligent production.
The professional software development team can support all kinds of industrial communication protocols and realize seamless connection with MES manufacturing execution system.

 

3.Specification

Model NEX40 NEX50 NEX60
Max throughput [side/h]
200
270 300
Grid [μm]
1
1.5 2
Min Dam/SRO* [μm]
40/60
50/80 60/120
DOF* [μm]
±150
±200 ±300
CDU ±10% ±10% ±10%
Wavelength Multi wavelength Multi wavelength Multi wavelength
Max exposure siez** 28.5"x24.5" 28.5"x24.5" 28.5"x24.5"
Alignment [μm] ±10 ±12 ±15

* Minimum weld bridges and openings and depth of field depend on ink characteristics and process.

** Standard table size, plus support for customized oversized dual tables (up to 49") for increased productivity.

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