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MAS35 Series LDI

The MAS35 is the industry's leading direct imaging DI system for multilayer, flexible board and HDI mass production, and achieves high throughput with conventional wet/dry film. The system utilizes DMD technology to achieve excellent line width uniformity and edge roughness for fine lines through high-precision data resolution capabilities, ensuring optimal quality while reducing overall operating costs.
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1.Product Introduction

The MAS35 is the industry's leading direct imaging DI system for multilayer, flexible board and HDI mass production, and achieves high throughput with conventional wet/dry film.

The system utilizes DMD technology to achieve excellent line width uniformity and edge roughness for fine lines through high-precision data resolution capabilities, ensuring optimal quality while reducing overall operating costs.

 

2.Product Feature

Industry Leading Direct Imaging System

Based on DMD scanning lithography solution, equipped with high-performance data processing technology and CFMEE professional optics, direct exposure without the need of negative can save cost, shorten the process and improve yield.

High-power LD laser with high-efficiency optical path design provides the highest throughput rate while flexibly matching with various types of light-sensitive materials.

 

High image quality and productivity

High resolution and high performance optical system to realize high imaging quality for fine lines.

High depth of field: Adopting the market-proven CFMEE professional optical design, it can bring excellent high depth of field ≥±150μm, and realize the best exposure imaging quality for various boards with uneven surface height.

High productivity: Dual-table mechanism optimizes exposure process and productivity, simultaneous loading/unloading/alignment and exposure.

 

Alignment accuracy and expansion/contraction mode

Equipped with high-precision moving platform and CCD target recognition system, the alignment accuracy is as high as ±8μm.

Shrinking function: automatic shrinking, fixed shrinking, sectional shrinking, partition shrinking, intelligent shrinking and other high-level shrinking modes, and in the process of alignment of abnormal boards automatic warning or refusal of exposure, to enhance quality control and improve yield.

Board exposure: according to the size of the substrate, one-time exposure of multiple pieces, greatly improving production capacity.

Alignment capability: the system automatically catches the target alignment at high speed, which can support all kinds of alignment targets, and can also use the fitting function for abnormal targets to ensure the alignment accuracy and improve the production capacity at the same time.

 

Product traceability

In any specified position, the exposure generates text or two-dimensional code, which can be used for the traceability of boards.

Support static and dynamic stamp labels, such as time, date, serial number, equipment number, up and down values and various combinations of serial numbers.

 

Intelligent Manufacturing

CFMEE DI products are equipped with hardware and software functions related to intelligent manufacturing to realize highly automated and intelligent production.

Professional software development team can support all kinds of industrial communication protocols to realize seamless connection with MES manufacturing execution system

 

3.Specification

Model MAS35
Max throughput [side/h]
480
Grid [μm]
1.8
Min. L/S* [μm]
35/35
DOF* [μm]
±300
CDU [μm]
±10%
Max exposure size** 28.5"x24.5"
Outlayer alignment accuracy [μm] ±12
Double-side alignment accuracy [μm] 24

* After development, the minimum line width/spacing and depth of field depend on the photographic material properties and the process.

** Standard countertop sizes, plus support for customized oversized dual countertops for increased productivity.

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