Products
MUD35
The MUD35 series laser drilling machine, suitable for blind via hole drilling on FPC and RFPCB, is independently developed by CFMEE, featuring high precision, high quality, and high efficiency.
MCD75T
The MCD75Tseries laser drilling machine, suitable for blind via hole drilling on HDI and IC Substrate PCB, is independently developed by CFMEE, featuring high precision, high quality, and high efficiency.
MAS15 Series LDI
The MAS15 is the industry's leading direct imaging DI system for HDI, high-grade HDI, and SLP mass production, with high-dose dry film for high throughput.
The system utilizes DMD technology to achieve excellent line width consistency and edge roughness for fine lines through high-precision data resolution capability, which ensures optimal quality while reducing overall operating costs.
MAS12 Series LDI
The MAS12 is the industry's leading direct imaging DI system for HDI, high-grade HDI and SLP mass production, with high-dose dry film for high throughput.
The system utilizes DMD technology to achieve excellent line width consistency and edge roughness for fine lines through high-precision data resolution capability, which ensures optimal quality while reducing overall operating costs.
MAS25 Series LDI
The MAS25 is the industry's leading direct imaging DI system for mass production of multilayers, flex boards, and HDI, with conventional wet/dry film for high throughput.
The system utilizes DMD technology to achieve excellent line width uniformity and edge roughness for fine lines through high-precision data resolution capabilities, ensuring optimal quality while reducing overall operating costs.
MAS35 Series LDI
The MAS35 is the industry's leading direct imaging DI system for multilayer, flexible board and HDI mass production, and achieves high throughput with conventional wet/dry film.
The system utilizes DMD technology to achieve excellent line width uniformity and edge roughness for fine lines through high-precision data resolution capabilities, ensuring optimal quality while reducing overall operating costs.
FAST35
FAST35 is an industry-leading direct imaging system for mass production of multi-layer boards with a small footprint and high throughput suitable for conventional dry film or liquid resist.
The system adopts DMD technology to achieve excellent line width uniformity and edge roughness on 35μm lines through high data resolution, reducing overall operating costs while guarantee optimal quality.
NEX-W DI Series for White Solder
A new generation of high-performance DI direct imaging systems for solder mask processes, designed with a high-power exposure source, combined with a high-precision imaging and positioning locator system.
NEX DI Series for SM
NEX series is a high performance direct imaging soldermask DI product that utilizes a high power exposure light source combined with high power imaging and high precision positioning system for non-white oil soldermask inks. They provide high productivity, high precision, and high quality window/bridge/side etch solutions for the soldermask process of multilayer boards, HDI, Rigid-Flex boards, Flex boards, and IC substrates.
Roll to Roll
RTR product series is the industry-leading RTR Direct Imaging systems, suitable for roll to roll exposure applications.
The system uses DMD technology to achieve line width uniformity on minimal 8μm fine lines through high data resolution, reducing overall operating costs while guarantee optimal quality.
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